SOLVENTLESS, ONE-PACK AND NORMAL-TEMPERATURE CURING IMPREGNATION MATERIAL

PROBLEM TO BE SOLVED: To provide an impregnation material permeating from the surface layer to the inside of fine pores of a porous material and seal the fine pores by a single coating work, free from the formation of a coating film on the surface of the porous material, remarkably suppressing water...

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Bibliographische Detailangaben
Hauptverfasser: MIZUKOSHI SHIGEKAZU, SACHI KEIKO, YAMAGUCHI TATSUO
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide an impregnation material permeating from the surface layer to the inside of fine pores of a porous material and seal the fine pores by a single coating work, free from the formation of a coating film on the surface of the porous material, remarkably suppressing water permeability, enabling remarkable suppression of the intrusion of carbon dioxide gas, etc., into the fine pores and resistant to the peeling of a coating film in the case of forming a coating film. SOLUTION: The solventless, one-pack and normal-temperature curing impregnation material comprises an alkoxysilane compound having an OR group or its partial hydrolytic condensate and a curing catalyst and has an initial viscosity of 2-80 mPa s at 25°C and a weight reduction 30 min after application of 0.5-16 wt.% at 25°C. COPYRIGHT: (C)2010,JPO&INPIT