BALL-BUMP BONDED RIBBON-WIRE INTERCONNECT AND METHOD OF CONNECTING ELECTRONIC COMPONENT TO SUBSTRATE

PROBLEM TO BE SOLVED: To enable a ribbon-wire to be bonded to a bond pad which is narrower than the ribbon-wire. SOLUTION: A ball-bump bonded ribbon-wire interconnect 10 has a ball-bump 16, attached to the bond pad 14 of an integrated circuit 12. The ribbon-wire 18 has one end attached to the ball-bump 16 and has the other end attached to the metallized surface 22 of a substrate 20. The ribbon-wire 18 may be wider than the ball-bump 16, and the ball-bump 16 may separate the ribbon-wire 18 from the surface of the integrated circuit 12. The ribbon-wire 18 may interconnect a plurality of integrated circuits 12, with each of these circuits 12 having a ball-bump 16 or a suitably wide metallized surface 22, to the metallized surface 22 of the substrate 20. The present invention may be used to electrically connect an electronic component to a substrate. COPYRIGHT: (C)2010,JPO&INPIT