SENSOR UNIT

PROBLEM TO BE SOLVED: To attain simplification of a structure of a sensor unit, cost reduction, enhancement of durability, prevention of water absorption, enhancement of heat-resistance or the like. SOLUTION: The sensor unit includes a case 10 having an outer peripheral wall 11; predetermined sensor...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: MIURA MIGAKU, KOGA TAKESHI
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To attain simplification of a structure of a sensor unit, cost reduction, enhancement of durability, prevention of water absorption, enhancement of heat-resistance or the like. SOLUTION: The sensor unit includes a case 10 having an outer peripheral wall 11; predetermined sensors 20, 30, 40 stored in the case; a mold resin material 70 poured into the case; and a cover 80 bonded to the outer peripheral wall so as to cover an opening part of the case. The case includes a partition wall 14 for partitioning a recession part; a sensor storage recession part 15 divided by the partition wall or the partition wall and the outer peripheral wall, storing the sensor and filled with the mold resin material; a plurality of adjacent recession parts 16 dividing the partition wall or the partition wall and the outer peripheral wall and adjacent to the sensor storage recession part; and a communication hole 17 formed on at least one adjacent recession part and communicated with the outside. According to this, cost can be reduced by reducing an amount of the mold resin material used, generation of water absorption action can be prevented at cooling of the sensor unit, and staying of a moisture content or the like can be prevented. COPYRIGHT: (C)2010,JPO&INPIT