CURABLE RESIN COMPOSITION
PROBLEM TO BE SOLVED: To provide a curable resin composition exhibiting a high torsional adhesion strength after curing adhesion. SOLUTION: The curable resin composition is produced by blending a curable silicone-based resin A with a curable silicone-based resin B, wherein the curable silicone-based...
Gespeichert in:
| Hauptverfasser: | , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | NOMURA YUKIHIRO INUI JUN SATO SHINICHI KUSUKI KOJI |
| description | PROBLEM TO BE SOLVED: To provide a curable resin composition exhibiting a high torsional adhesion strength after curing adhesion. SOLUTION: The curable resin composition is produced by blending a curable silicone-based resin A with a curable silicone-based resin B, wherein the curable silicone-based resin A is primarily comprised of an oxyalkylene polymer as a main chain, and has a hydrolyzable silicone group on its terminals, and the content of the silicone atom originated in the hydrolyzable silicone group is 0.35-2.00 mass%, and the curable silicone-based resin B is mainly comprised of a vinyl polymer as a main chain, and has a hydrolyzable silicone group on its terminals and its side chains, and the content of the silicone atom originated in the hydrolyzable silicone group is 2.20-11.50 mass%. The compounding ratio of the curable silicone-based resin A to the curable silicone-based resin B is 30-80:70-20 (mass ratio). COPYRIGHT: (C)2010,JPO&INPIT |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2009275157A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2009275157A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2009275157A3</originalsourceid><addsrcrecordid>eNrjZJB0Dg1ydPJxVQhyDfb0U3D29w3wD_YM8fT342FgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8V4BRgYGlkbmpoam5o7GRCkCAFwVIJM</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>CURABLE RESIN COMPOSITION</title><source>esp@cenet</source><creator>NOMURA YUKIHIRO ; INUI JUN ; SATO SHINICHI ; KUSUKI KOJI</creator><creatorcontrib>NOMURA YUKIHIRO ; INUI JUN ; SATO SHINICHI ; KUSUKI KOJI</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a curable resin composition exhibiting a high torsional adhesion strength after curing adhesion. SOLUTION: The curable resin composition is produced by blending a curable silicone-based resin A with a curable silicone-based resin B, wherein the curable silicone-based resin A is primarily comprised of an oxyalkylene polymer as a main chain, and has a hydrolyzable silicone group on its terminals, and the content of the silicone atom originated in the hydrolyzable silicone group is 0.35-2.00 mass%, and the curable silicone-based resin B is mainly comprised of a vinyl polymer as a main chain, and has a hydrolyzable silicone group on its terminals and its side chains, and the content of the silicone atom originated in the hydrolyzable silicone group is 2.20-11.50 mass%. The compounding ratio of the curable silicone-based resin A to the curable silicone-based resin B is 30-80:70-20 (mass ratio). COPYRIGHT: (C)2010,JPO&INPIT</description><language>eng</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; DYES ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; POLISHES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2009</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20091126&DB=EPODOC&CC=JP&NR=2009275157A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20091126&DB=EPODOC&CC=JP&NR=2009275157A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>NOMURA YUKIHIRO</creatorcontrib><creatorcontrib>INUI JUN</creatorcontrib><creatorcontrib>SATO SHINICHI</creatorcontrib><creatorcontrib>KUSUKI KOJI</creatorcontrib><title>CURABLE RESIN COMPOSITION</title><description>PROBLEM TO BE SOLVED: To provide a curable resin composition exhibiting a high torsional adhesion strength after curing adhesion. SOLUTION: The curable resin composition is produced by blending a curable silicone-based resin A with a curable silicone-based resin B, wherein the curable silicone-based resin A is primarily comprised of an oxyalkylene polymer as a main chain, and has a hydrolyzable silicone group on its terminals, and the content of the silicone atom originated in the hydrolyzable silicone group is 0.35-2.00 mass%, and the curable silicone-based resin B is mainly comprised of a vinyl polymer as a main chain, and has a hydrolyzable silicone group on its terminals and its side chains, and the content of the silicone atom originated in the hydrolyzable silicone group is 2.20-11.50 mass%. The compounding ratio of the curable silicone-based resin A to the curable silicone-based resin B is 30-80:70-20 (mass ratio). COPYRIGHT: (C)2010,JPO&INPIT</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>DYES</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2009</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJB0Dg1ydPJxVQhyDfb0U3D29w3wD_YM8fT342FgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8V4BRgYGlkbmpoam5o7GRCkCAFwVIJM</recordid><startdate>20091126</startdate><enddate>20091126</enddate><creator>NOMURA YUKIHIRO</creator><creator>INUI JUN</creator><creator>SATO SHINICHI</creator><creator>KUSUKI KOJI</creator><scope>EVB</scope></search><sort><creationdate>20091126</creationdate><title>CURABLE RESIN COMPOSITION</title><author>NOMURA YUKIHIRO ; INUI JUN ; SATO SHINICHI ; KUSUKI KOJI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2009275157A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2009</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>DYES</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>NOMURA YUKIHIRO</creatorcontrib><creatorcontrib>INUI JUN</creatorcontrib><creatorcontrib>SATO SHINICHI</creatorcontrib><creatorcontrib>KUSUKI KOJI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>NOMURA YUKIHIRO</au><au>INUI JUN</au><au>SATO SHINICHI</au><au>KUSUKI KOJI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>CURABLE RESIN COMPOSITION</title><date>2009-11-26</date><risdate>2009</risdate><abstract>PROBLEM TO BE SOLVED: To provide a curable resin composition exhibiting a high torsional adhesion strength after curing adhesion. SOLUTION: The curable resin composition is produced by blending a curable silicone-based resin A with a curable silicone-based resin B, wherein the curable silicone-based resin A is primarily comprised of an oxyalkylene polymer as a main chain, and has a hydrolyzable silicone group on its terminals, and the content of the silicone atom originated in the hydrolyzable silicone group is 0.35-2.00 mass%, and the curable silicone-based resin B is mainly comprised of a vinyl polymer as a main chain, and has a hydrolyzable silicone group on its terminals and its side chains, and the content of the silicone atom originated in the hydrolyzable silicone group is 2.20-11.50 mass%. The compounding ratio of the curable silicone-based resin A to the curable silicone-based resin B is 30-80:70-20 (mass ratio). COPYRIGHT: (C)2010,JPO&INPIT</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_JP2009275157A |
| source | esp@cenet |
| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS AS ADHESIVES |
| title | CURABLE RESIN COMPOSITION |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-22T04%3A56%3A45IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=NOMURA%20YUKIHIRO&rft.date=2009-11-26&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2009275157A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |