CURABLE RESIN COMPOSITION

CURABLE RESIN COMPOSITION

PROBLEM TO BE SOLVED: To provide a curable resin composition exhibiting a high torsional adhesion strength after curing adhesion. SOLUTION: The curable resin composition is produced by blending a curable silicone-based resin A with a curable silicone-based resin B, wherein the curable silicone-based...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: NOMURA YUKIHIRO, INUI JUN, SATO SHINICHI, KUSUKI KOJI
Format: Patent
Sprache:eng
Schlagworte:
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
DYES
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
ORGANIC MACROMOLECULAR COMPOUNDS
PAINTS
POLISHES
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
USE OF MATERIALS AS ADHESIVES
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a curable resin composition exhibiting a high torsional adhesion strength after curing adhesion. SOLUTION: The curable resin composition is produced by blending a curable silicone-based resin A with a curable silicone-based resin B, wherein the curable silicone-based resin A is primarily comprised of an oxyalkylene polymer as a main chain, and has a hydrolyzable silicone group on its terminals, and the content of the silicone atom originated in the hydrolyzable silicone group is 0.35-2.00 mass%, and the curable silicone-based resin B is mainly comprised of a vinyl polymer as a main chain, and has a hydrolyzable silicone group on its terminals and its side chains, and the content of the silicone atom originated in the hydrolyzable silicone group is 2.20-11.50 mass%. The compounding ratio of the curable silicone-based resin A to the curable silicone-based resin B is 30-80:70-20 (mass ratio). COPYRIGHT: (C)2010,JPO&INPIT