SPUTTERING DEVICE

PROBLEM TO BE SOLVED: To obtain a simple structure that has the sufficient electrostatic attraction force and quick removal property of a substrate with regard to an electrostatic chuck having a dielectric plate formed on the surfaces of a plurality of protrusions that support the substrate with top faces thereof, an electrode provided inside the dielectric plate, and an external power supply that applies voltage to the electrode. SOLUTION: The electrostatic chuck in a sputtering device includes the dielectric plate on a surface of which a plurality of the protrusions that support the substrate with the top faces of a plurality of protrusions and circumferential recesses of the protrusions are formed, and the electrode provided inside the dielectric plate and to which voltage is applied from the external power supply. The dielectric plate at least has a conductive film provided on the top faces of the protrusions, and the top faces of the protrusions with the conductive film have roughness with Ry (maximum surface roughness) of ≤2.5 μm and Ra (central line average roughness) of ≤0.25 μm. COPYRIGHT: (C)2010,JPO&INPIT