SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To improve reliability of wiring by preventing wiring metal from corroding due to water in an insulating film. SOLUTION: A semiconductor device having embedded wiring includes inter-wiring insulating films 111 and 112 having a groove 113 for wiring partially formed, a metal wir...

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Bibliographische Detailangaben
Hauptverfasser:	HAYASHI HIROMI, WATABE TADAYOSHI, USUI TAKAMASA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To improve reliability of wiring by preventing wiring metal from corroding due to water in an insulating film. SOLUTION: A semiconductor device having embedded wiring includes inter-wiring insulating films 111 and 112 having a groove 113 for wiring partially formed, a metal wiring layer 115 buried in the groove 113 for wiring of the inter-wiring insulating films 111 and 112 and forming a gap with a sidewall surface of the groove 113 for wiring, and a waterproof barrier layer 118 formed so as to cover a sidewall surface and an upper surface of the wiring layer 115. COPYRIGHT: (C)2010,JPO&INPIT