SEMICONDUCTOR MANUFACTURING DEVICE

SEMICONDUCTOR MANUFACTURING DEVICE

PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing device with high productivity that shortens a joining time by joining wire joining portions of both a semiconductor chip and a post at the same time, and is easy to maintain. SOLUTION: The semiconductor manufacturing device has an ultras...

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Hauptverfasser: USUDA OSAMU, KISHIMOTO MAKOTO
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator USUDA OSAMU
KISHIMOTO MAKOTO
description PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing device with high productivity that shortens a joining time by joining wire joining portions of both a semiconductor chip and a post at the same time, and is easy to maintain. SOLUTION: The semiconductor manufacturing device has an ultrasonic tool for carrying out ultrasonic joining of a wire to the semiconductor chip and a mounted component, the ultrasonic tool having a first projection portion which is provided projecting toward the semiconductor chip and enables an ultrasonic wave to be applied while holding and pressing part of the wire against the semiconductor chip, and a second projection portion which is provided projecting toward the mounted component and enables an ultrasonic wave to be applied while holding and pressing the other part of the wire. COPYRIGHT: (C)2010,JPO&INPIT
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title SEMICONDUCTOR MANUFACTURING DEVICE
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