SEMICONDUCTOR MANUFACTURING DEVICE
PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing device with high productivity that shortens a joining time by joining wire joining portions of both a semiconductor chip and a post at the same time, and is easy to maintain. SOLUTION: The semiconductor manufacturing device has an ultras...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing device with high productivity that shortens a joining time by joining wire joining portions of both a semiconductor chip and a post at the same time, and is easy to maintain. SOLUTION: The semiconductor manufacturing device has an ultrasonic tool for carrying out ultrasonic joining of a wire to the semiconductor chip and a mounted component, the ultrasonic tool having a first projection portion which is provided projecting toward the semiconductor chip and enables an ultrasonic wave to be applied while holding and pressing part of the wire against the semiconductor chip, and a second projection portion which is provided projecting toward the mounted component and enables an ultrasonic wave to be applied while holding and pressing the other part of the wire. COPYRIGHT: (C)2010,JPO&INPIT |
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