METHOD FOR FABRICATING CONDUCTIVE PATTERN ON FLEXIBLE SUBSTRATE AND PROTECTIVE INK USED THEREIN

PROBLEM TO BE SOLVED: To provide a method for fabricating a conductive pattern on a flexible substrate. SOLUTION: A flexible substrate 100 having a conductive layer 200 thereon is prepared. A protective ink 300 is screen printed on the conductive layer 200. A portion of the conductive layer 200 is e...

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Bibliographische Detailangaben
Hauptverfasser:	LIU SHIH-HSIEN, CHO SHINTEI, GO HOBI, CHAO WEN-HSUAN
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method for fabricating a conductive pattern on a flexible substrate. SOLUTION: A flexible substrate 100 having a conductive layer 200 thereon is prepared. A protective ink 300 is screen printed on the conductive layer 200. A portion of the conductive layer 200 is exposed through the protective ink 300. The exposed portion of the conductive layer 200 is removed by etching using the protective ink 300 as a mask. The protective ink 300 is then removed to form a conductive pattern 250 with a minimum line width of not greater than 150 μm. A composition for the protective ink is also disclosed. COPYRIGHT: (C)2010,JPO&INPIT