COMPONENT BUILT-IN WIRING BOARD
PROBLEM TO BE SOLVED: To provide a component built-in wiring board which can eliminate the problem caused by that the length of a wiring for connecting a component to a capacitor becomes long. SOLUTION: The component built-in wiring board 10 includes a core substrate 11, a first component 61, a main...
Gespeichert in:
Hauptverfasser: | , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a component built-in wiring board which can eliminate the problem caused by that the length of a wiring for connecting a component to a capacitor becomes long. SOLUTION: The component built-in wiring board 10 includes a core substrate 11, a first component 61, a main surface side wiring built-up layer 31 and a capacitor 101. The core substrate 11 has a housing hole 90 and the first component 61 is housed in the housing hole 90. A component mounting region 20 capable of mounting a second component 21 is provided in a surface 39 of the main surface side wiring built-up layer 31. The capacitor 101 has electrode layers 102 and 103 and a dielectric layer 104. The capacitor 101 is embedded in the main surface side wiring built-up layer 31 such that a first front surface 105 and a second front surface 106 in the electrode layer 102 and a first front surface 107 and a second front surface 108 in the electrode layer 103 are disposed in parallel with the surface 39 of the main surface side wiring built-up layer 31. COPYRIGHT: (C)2010,JPO&INPIT |
---|