COMPONENT BUILT-IN WIRING BOARD

PROBLEM TO BE SOLVED: To provide a component built-in wiring board which can eliminate the problem caused by that the length of a wiring for connecting a component to a capacitor becomes long. SOLUTION: The component built-in wiring board 10 includes a core substrate 11, a first component 61, a main...

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Bibliographische Detailangaben
Hauptverfasser: ORIGUCHI MAKOTO, TAKASHIMA YASUAKI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a component built-in wiring board which can eliminate the problem caused by that the length of a wiring for connecting a component to a capacitor becomes long. SOLUTION: The component built-in wiring board 10 includes a core substrate 11, a first component 61, a main surface side wiring built-up layer 31 and a capacitor 101. The core substrate 11 has a housing hole 90 and the first component 61 is housed in the housing hole 90. A component mounting region 20 capable of mounting a second component 21 is provided in a surface 39 of the main surface side wiring built-up layer 31. The capacitor 101 has electrode layers 102 and 103 and a dielectric layer 104. The capacitor 101 is embedded in the main surface side wiring built-up layer 31 such that a first front surface 105 and a second front surface 106 in the electrode layer 102 and a first front surface 107 and a second front surface 108 in the electrode layer 103 are disposed in parallel with the surface 39 of the main surface side wiring built-up layer 31. COPYRIGHT: (C)2010,JPO&INPIT