SHEET FOR SEALING OPTICAL SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a sheet for sealing an optical device, which can provide an optical semiconductor device having excellent luminance retention, low sealable temperature at which a wire connected to the optical semiconductor chip does not break, and a small coefficient of sheet extens...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	HIRANO KEISUKE, AKAZAWA MITSUHARU
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a sheet for sealing an optical device, which can provide an optical semiconductor device having excellent luminance retention, low sealable temperature at which a wire connected to the optical semiconductor chip does not break, and a small coefficient of sheet extension, namely, satisfactory resistance to reflow, under high temperature after sealing. SOLUTION: The sheet for sealing an optical semiconductor device contains an acryl-based polymer having a functional group and a cross-linking agent composed of an epoxy resin or an acid anhydride, wherein the functional group is one or more selected from the group consisting of carboxyl group, epoxy group, and hydroxyl group. COPYRIGHT: (C)2010,JPO&INPIT