PLATING DIE AND METHOD FOR MANUFACTURING METAL FOIL BY USING THE SAME

PLATING DIE AND METHOD FOR MANUFACTURING METAL FOIL BY USING THE SAME

PROBLEM TO BE SOLVED: To provide a plating die for manufacturing a metal foil having an opening by peeling a metal foil formed by plating from a conductive base material, the plating die superior in repetition of manufacturing of metal foils with high performance or productivity, and to provide a me...

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1. Verfasser: KOMATA KAZUYOSHI
Format: Patent
Sprache:eng
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APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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creator KOMATA KAZUYOSHI
description PROBLEM TO BE SOLVED: To provide a plating die for manufacturing a metal foil having an opening by peeling a metal foil formed by plating from a conductive base material, the plating die superior in repetition of manufacturing of metal foils with high performance or productivity, and to provide a method for manufacturing a metal foil by using the die. SOLUTION: The method for manufacturing a metal foil is carried out by using a plating die characterized in through-holes present in dots formed in a conductive base material and an insulating material filling the holes, and the method comprises; forming a metal foil having an opening by electroplating, with the conductive base material used as an electrode, to precipitate a metal on a part of the surface of the conductive base material and the insulating material in a periphery of the base material, followed by peeling the metal foil from the conductive base material. COPYRIGHT: (C)2010,JPO&INPIT
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SOLUTION: The method for manufacturing a metal foil is carried out by using a plating die characterized in through-holes present in dots formed in a conductive base material and an insulating material filling the holes, and the method comprises; forming a metal foil having an opening by electroplating, with the conductive base material used as an electrode, to precipitate a metal on a part of the surface of the conductive base material and the insulating material in a periphery of the base material, followed by peeling the metal foil from the conductive base material. 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SOLUTION: The method for manufacturing a metal foil is carried out by using a plating die characterized in through-holes present in dots formed in a conductive base material and an insulating material filling the holes, and the method comprises; forming a metal foil having an opening by electroplating, with the conductive base material used as an electrode, to precipitate a metal on a part of the surface of the conductive base material and the insulating material in a periphery of the base material, followed by peeling the metal foil from the conductive base material. 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SOLUTION: The method for manufacturing a metal foil is carried out by using a plating die characterized in through-holes present in dots formed in a conductive base material and an insulating material filling the holes, and the method comprises; forming a metal foil having an opening by electroplating, with the conductive base material used as an electrode, to precipitate a metal on a part of the surface of the conductive base material and the insulating material in a periphery of the base material, followed by peeling the metal foil from the conductive base material. COPYRIGHT: (C)2010,JPO&amp;INPIT</abstract><oa>free_for_read</oa></addata></record>
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subjects APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
title PLATING DIE AND METHOD FOR MANUFACTURING METAL FOIL BY USING THE SAME
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