PLATING DIE AND METHOD FOR MANUFACTURING METAL FOIL BY USING THE SAME

PROBLEM TO BE SOLVED: To provide a plating die for manufacturing a metal foil having an opening by peeling a metal foil formed by plating from a conductive base material, the plating die superior in repetition of manufacturing of metal foils with high performance or productivity, and to provide a me...

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Bibliographische Detailangaben
1. Verfasser:	KOMATA KAZUYOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a plating die for manufacturing a metal foil having an opening by peeling a metal foil formed by plating from a conductive base material, the plating die superior in repetition of manufacturing of metal foils with high performance or productivity, and to provide a method for manufacturing a metal foil by using the die. SOLUTION: The method for manufacturing a metal foil is carried out by using a plating die characterized in through-holes present in dots formed in a conductive base material and an insulating material filling the holes, and the method comprises; forming a metal foil having an opening by electroplating, with the conductive base material used as an electrode, to precipitate a metal on a part of the surface of the conductive base material and the insulating material in a periphery of the base material, followed by peeling the metal foil from the conductive base material. COPYRIGHT: (C)2010,JPO&INPIT