SUBSTRATE FOR MOUNTING ELEMENT, SEMICONDUCTOR MODULE, AN PORTABLE APPARATUS

SUBSTRATE FOR MOUNTING ELEMENT, SEMICONDUCTOR MODULE, AN PORTABLE APPARATUS

PROBLEM TO BE SOLVED: To improve connection reliability between a projection structure and an electrode of a semiconductor element, in a structure connecting the projection structure to the electrode of the semiconductor element. SOLUTION: The substrate 10 for mounting an element includes: an insula...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SAITO KOICHI, NAKAZATO MAYUMI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Zusammenfassung:PROBLEM TO BE SOLVED: To improve connection reliability between a projection structure and an electrode of a semiconductor element, in a structure connecting the projection structure to the electrode of the semiconductor element. SOLUTION: The substrate 10 for mounting an element includes: an insulating resin layer 12; a wiring layer 14 formed on one-side principal surface S1 of the insulating resin layer 12; projecting electrodes 16 electrically connected to the wiring layer 14, and projecting to the insulating resin layer 12 side from the wiring layer 14; and a backing member 18 having at least part thereof embedded in the insulating resin layer 12 for backing the insulating resin layer 12. COPYRIGHT: (C)2010,JPO&INPIT