THERMOPLASTIC POLYURETHANE RESIN COMPOSITION FOR PLATED DUAL MOLDING, DUAL-MOLDED PRODUCT FOR PLATING, PLATED DUAL-MOLDED PRODUCT, AND METHOD FOR PRODUCING THEM

PROBLEM TO BE SOLVED: To provide a thermoplastic polyurethane resin composition for plated dual molding to obtain a dual-molded product for plating, which consists of a first molded body formed of a hard resin and a second molded body formed of a soft resin and exhibits sufficient plating processing...

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Bibliographische Detailangaben
1. Verfasser:	ENOKIDA TAKESHI
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G APPARATUS THEREFOR CHEMISTRY COMPOSITIONS BASED THEREON ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES GENERAL PROCESSES OF COMPOUNDING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING-UP
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Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a thermoplastic polyurethane resin composition for plated dual molding to obtain a dual-molded product for plating, which consists of a first molded body formed of a hard resin and a second molded body formed of a soft resin and exhibits sufficient plating processing resistance since discoloring by plating processing is sufficiently suppressed in the molded body formed of the soft resin. SOLUTION: The thermoplastic polyurethane resin composition for plated dual molding comprises an organic diisocyanate (A) principally consisting of a hexamethylene diisocyanate (a1), a high polymer polyol (B) principally consisting of a polycarbonate diol (b1), and a chain extender (C) principally consisting of a 2-10C aliphatic diol (c1). COPYRIGHT: (C)2010,JPO&INPIT