FINE STRUCTURE TRANSFERRING STAMPER AND FINE STRUCTURE TRANSFERRING APPARATUS

PROBLEM TO BE SOLVED: To provide a fine structure transferring apparatus capable of uniformly forming the thickness of a thin film layer by following a projecting shape on the surface of a body to be transferred and highly accurately aligning a stamper and the body to be transferred, and to provide...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	WASHITANI RYUTA, OGINO MASAHIKO, MIYAUCHI AKIHIRO, ANDO TAKUJI
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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