FINE STRUCTURE TRANSFERRING STAMPER AND FINE STRUCTURE TRANSFERRING APPARATUS

PROBLEM TO BE SOLVED: To provide a fine structure transferring apparatus capable of uniformly forming the thickness of a thin film layer by following a projecting shape on the surface of a body to be transferred and highly accurately aligning a stamper and the body to be transferred, and to provide...

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Bibliographische Detailangaben
Hauptverfasser: WASHITANI RYUTA, OGINO MASAHIKO, MIYAUCHI AKIHIRO, ANDO TAKUJI
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a fine structure transferring apparatus capable of uniformly forming the thickness of a thin film layer by following a projecting shape on the surface of a body to be transferred and highly accurately aligning a stamper and the body to be transferred, and to provide a fine structure transferring stamper. SOLUTION: The fine structure transferring stamper transfers a fine unevenness of the stamper on the surface of the body to be transferred by bringing the stamper on which the fine unevenness is formed into contact with the body to be transferred. The stamper is constituted of a pattern layer 2 formed with the fine unevenness and a substrate 3 holding it, and a face of the substrate coming into contact with the pattern layer of the substrate is composed of a flat face and a curved face. The pattern layer is held on the curved face of the substrate, and there exists an alignment mark for positioning with the body to be transferred on the flat face. COPYRIGHT: (C)2010,JPO&INPIT