FINE STRUCTURE TRANSFERRING STAMPER AND FINE STRUCTURE TRANSFERRING APPARATUS

PROBLEM TO BE SOLVED: To provide a fine structure transferring apparatus capable of uniformly forming the thickness of a thin film layer by following a projecting shape on the surface of a body to be transferred and highly accurately aligning a stamper and the body to be transferred, and to provide...

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Hauptverfasser:	WASHITANI RYUTA, OGINO MASAHIKO, MIYAUCHI AKIHIRO, ANDO TAKUJI
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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creator	WASHITANI RYUTA OGINO MASAHIKO MIYAUCHI AKIHIRO ANDO TAKUJI
description	PROBLEM TO BE SOLVED: To provide a fine structure transferring apparatus capable of uniformly forming the thickness of a thin film layer by following a projecting shape on the surface of a body to be transferred and highly accurately aligning a stamper and the body to be transferred, and to provide a fine structure transferring stamper. SOLUTION: The fine structure transferring stamper transfers a fine unevenness of the stamper on the surface of the body to be transferred by bringing the stamper on which the fine unevenness is formed into contact with the body to be transferred. The stamper is constituted of a pattern layer 2 formed with the fine unevenness and a substrate 3 holding it, and a face of the substrate coming into contact with the pattern layer of the substrate is composed of a flat face and a curved face. The pattern layer is held on the curved face of the substrate, and there exists an alignment mark for positioning with the body to be transferred on the flat face. COPYRIGHT: (C)2010,JPO&INPIT
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fullrecord	<record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2009241330A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2009241330A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2009241330A3</originalsourceid><addsrcrecordid>eNrjZPB18_RzVQgOCQp1DgkNclUICXL0C3ZzDQry9HMHCjv6BrgGKTj6uSjgU-cYEOAY5BgSGszDwJqWmFOcyguluRmU3FxDnD10Uwvy41OLCxKTU_NSS-K9AowMDCyNTAyNjQ0cjYlSBACXgi9I</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>FINE STRUCTURE TRANSFERRING STAMPER AND FINE STRUCTURE TRANSFERRING APPARATUS</title><source>esp@cenet</source><creator>WASHITANI RYUTA ; OGINO MASAHIKO ; MIYAUCHI AKIHIRO ; ANDO TAKUJI</creator><creatorcontrib>WASHITANI RYUTA ; OGINO MASAHIKO ; MIYAUCHI AKIHIRO ; ANDO TAKUJI</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a fine structure transferring apparatus capable of uniformly forming the thickness of a thin film layer by following a projecting shape on the surface of a body to be transferred and highly accurately aligning a stamper and the body to be transferred, and to provide a fine structure transferring stamper. SOLUTION: The fine structure transferring stamper transfers a fine unevenness of the stamper on the surface of the body to be transferred by bringing the stamper on which the fine unevenness is formed into contact with the body to be transferred. The stamper is constituted of a pattern layer 2 formed with the fine unevenness and a substrate 3 holding it, and a face of the substrate coming into contact with the pattern layer of the substrate is composed of a flat face and a curved face. The pattern layer is held on the curved face of the substrate, and there exists an alignment mark for positioning with the body to be transferred on the flat face. COPYRIGHT: (C)2010,JPO&INPIT</description><language>eng</language><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING ; BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; PERFORMING OPERATIONS ; SEMICONDUCTOR DEVICES ; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR ; SHAPING OR JOINING OF PLASTICS ; TRANSPORTING ; WORKING OF PLASTICS ; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><creationdate>2009</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20091022&DB=EPODOC&CC=JP&NR=2009241330A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20091022&DB=EPODOC&CC=JP&NR=2009241330A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>WASHITANI RYUTA</creatorcontrib><creatorcontrib>OGINO MASAHIKO</creatorcontrib><creatorcontrib>MIYAUCHI AKIHIRO</creatorcontrib><creatorcontrib>ANDO TAKUJI</creatorcontrib><title>FINE STRUCTURE TRANSFERRING STAMPER AND FINE STRUCTURE TRANSFERRING APPARATUS</title><description>PROBLEM TO BE SOLVED: To provide a fine structure transferring apparatus capable of uniformly forming the thickness of a thin film layer by following a projecting shape on the surface of a body to be transferred and highly accurately aligning a stamper and the body to be transferred, and to provide a fine structure transferring stamper. SOLUTION: The fine structure transferring stamper transfers a fine unevenness of the stamper on the surface of the body to be transferred by bringing the stamper on which the fine unevenness is formed into contact with the body to be transferred. The stamper is constituted of a pattern layer 2 formed with the fine unevenness and a substrate 3 holding it, and a face of the substrate coming into contact with the pattern layer of the substrate is composed of a flat face and a curved face. The pattern layer is held on the curved face of the substrate, and there exists an alignment mark for positioning with the body to be transferred on the flat face. COPYRIGHT: (C)2010,JPO&INPIT</description><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>PERFORMING OPERATIONS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</subject><subject>SHAPING OR JOINING OF PLASTICS</subject><subject>TRANSPORTING</subject><subject>WORKING OF PLASTICS</subject><subject>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2009</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPB18_RzVQgOCQp1DgkNclUICXL0C3ZzDQry9HMHCjv6BrgGKTj6uSjgU-cYEOAY5BgSGszDwJqWmFOcyguluRmU3FxDnD10Uwvy41OLCxKTU_NSS-K9AowMDCyNTAyNjQ0cjYlSBACXgi9I</recordid><startdate>20091022</startdate><enddate>20091022</enddate><creator>WASHITANI RYUTA</creator><creator>OGINO MASAHIKO</creator><creator>MIYAUCHI AKIHIRO</creator><creator>ANDO TAKUJI</creator><scope>EVB</scope></search><sort><creationdate>20091022</creationdate><title>FINE STRUCTURE TRANSFERRING STAMPER AND FINE STRUCTURE TRANSFERRING APPARATUS</title><author>WASHITANI RYUTA ; OGINO MASAHIKO ; MIYAUCHI AKIHIRO ; ANDO TAKUJI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2009241330A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2009</creationdate><topic>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>PERFORMING OPERATIONS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</topic><topic>SHAPING OR JOINING OF PLASTICS</topic><topic>TRANSPORTING</topic><topic>WORKING OF PLASTICS</topic><topic>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</topic><toplevel>online_resources</toplevel><creatorcontrib>WASHITANI RYUTA</creatorcontrib><creatorcontrib>OGINO MASAHIKO</creatorcontrib><creatorcontrib>MIYAUCHI AKIHIRO</creatorcontrib><creatorcontrib>ANDO TAKUJI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>WASHITANI RYUTA</au><au>OGINO MASAHIKO</au><au>MIYAUCHI AKIHIRO</au><au>ANDO TAKUJI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>FINE STRUCTURE TRANSFERRING STAMPER AND FINE STRUCTURE TRANSFERRING APPARATUS</title><date>2009-10-22</date><risdate>2009</risdate><abstract>PROBLEM TO BE SOLVED: To provide a fine structure transferring apparatus capable of uniformly forming the thickness of a thin film layer by following a projecting shape on the surface of a body to be transferred and highly accurately aligning a stamper and the body to be transferred, and to provide a fine structure transferring stamper. SOLUTION: The fine structure transferring stamper transfers a fine unevenness of the stamper on the surface of the body to be transferred by bringing the stamper on which the fine unevenness is formed into contact with the body to be transferred. The stamper is constituted of a pattern layer 2 formed with the fine unevenness and a substrate 3 holding it, and a face of the substrate coming into contact with the pattern layer of the substrate is composed of a flat face and a curved face. The pattern layer is held on the curved face of the substrate, and there exists an alignment mark for positioning with the body to be transferred on the flat face. COPYRIGHT: (C)2010,JPO&INPIT</abstract><oa>free_for_read</oa></addata></record>
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recordid	cdi_epo_espacenet_JP2009241330A
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subjects	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
title	FINE STRUCTURE TRANSFERRING STAMPER AND FINE STRUCTURE TRANSFERRING APPARATUS
url	https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-10T14%3A46%3A18IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=WASHITANI%20RYUTA&rft.date=2009-10-22&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2009241330A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true