SEMICONDUCTOR PACKAGE, AND MANUFACTURING METHOD OF THE SAME

PROBLEM TO BE SOLVED: To provide a semiconductor package can increase adhesion between a die pad and a mold resin by a simple means; and a manufacturing method of the same. SOLUTION: A plurality of leads 2 are arranged around a die pad 1. A semiconductor chip 4 is die-bonded onto the die pad 1 through resin paste 3. The plurality of leads 2 and the semiconductor chip 4 are connected to each other through a plurality of wires 5. A mold resin 6 seals the semiconductor chip 4 and the plurality of wires 5 while exposing the undersurface of the die pad 1. The mold resin 6 is prepared by, for instance, mixing a mold release agent in an epoxy resin. On the die pad 1, projections 7 are formed by applying the resin paste 3 to a region where the semiconductor chip 4 is not die-bonded in point-like forms. COPYRIGHT: (C)2010,JPO&INPIT