MANUFACTURING METHOD OF ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To prevent flash from being generated in an electrode layer of an electronic component. SOLUTION: In a manufacturing method of an electronic component, a laminate 10 is formed in a formation process, where the laminate has a dielectric layer 13, and a first electrode layer 15 a...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: KOMURO EIKI, OIKAWA YASUNOBU
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To prevent flash from being generated in an electrode layer of an electronic component. SOLUTION: In a manufacturing method of an electronic component, a laminate 10 is formed in a formation process, where the laminate has a dielectric layer 13, and a first electrode layer 15 and a second one 17 that oppose each other, while the dielectric layer 13 is sandwiched by them. Then, in first and second etching processes, the first and second electrode layers 15, 17 are subjected to etching of division patterns 16, 18 along a division line L for dividing the laminate 10 into a plurality of electronic components. As a result, a portion on the division line L of the first and second electrode layers 15, 17 is removed, thus burrs are prevented from being generated between the first and second electrode layers 5, 7 of an electronic component, thereby the laminate 10 are readily divided into a plurality of electronic components. COPYRIGHT: (C)2010,JPO&INPIT