ANISOTROPIC CONDUCTIVE FILM TRANSFER TOOL AND CONNECTION METHOD

PROBLEM TO BE SOLVED: To easily temporarily stick an anisotropic conductive tape to a transfer object surface by a transfer tool having no heating part and power source part. SOLUTION: This anisotropic conductive film transfer tool is provided for pressure-sensitively transferring an anisotropic con...

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1. Verfasser: MASUKO DAISUKE
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To easily temporarily stick an anisotropic conductive tape to a transfer object surface by a transfer tool having no heating part and power source part. SOLUTION: This anisotropic conductive film transfer tool is provided for pressure-sensitively transferring an anisotropic conductive film on the transfer object surface from the anisotropic conductive tape of temporarily sticking the anisotropic conductive film on a base material tape, and includes a rolling-out reel for winding the anisotropic conductive tape with its anisotropic conductive film on the outside, a transfer head for transferring the anisotropic conductive film on the transfer object surface by pressing the anisotropic conductive tape pulled out of the rolling-out reel to the transfer object surface, a winding reel for winding the base material tape after transferring the anisotropic conductive film to the transfer object surface, and an interlocking mechanism for interlocking rotation of the rolling-out reel and the winding reel so as not to loosen the anisotropic conductive tape. Tensile breaking stress in an unhardened state of the anisotropic conductive film is 1.0-5.0 MPa, and when the anisotropic conductive film is transferred to a glass fiber reinforced epoxy plate, 90-degree exfoliation adhesion strength in the unhardened state is 1.0-2.5 N/cm. COPYRIGHT: (C)2010,JPO&INPIT