SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a semiconductor device structured to improve tamper resistance in order to prevent a third party from analyzing the interior of a semiconductor device by using fraudulent means, preventing device size increase and reliability degradation, and to provide a method of m...

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Hauptverfasser:	NISHIMURA TAKAO, KUMAGAI KINICHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CALCULATING COMPUTING COUNTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HANDLING RECORD CARRIERS PHYSICS PRESENTATION OF DATA RECOGNITION OF DATA RECORD CARRIERS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a semiconductor device structured to improve tamper resistance in order to prevent a third party from analyzing the interior of a semiconductor device by using fraudulent means, preventing device size increase and reliability degradation, and to provide a method of manufacturing the semiconductor device easily. SOLUTION: The semiconductor device includes the semiconductor element 12, a plate member 11 disposed opposite to an electronic circuit forming portion 13 of the semiconductor element 12, and an elastic body 25 arranged in a compressed state between the semiconductor element 12 and the plate member 11. The elastic body 25 has at least one protruding portion 25a at one end in an extension direction of the elastic body 25, the first protruding portion being formed opposite to the electronic-circuit forming portion 13 of the semiconductor element 12, and the semiconductor element 12 and the plate member 11 are fastened by an adhesive agent 27. COPYRIGHT: (C)2010,JPO&INPIT