MODIFIED POLYALUMINOSILOXANE

PROBLEM TO BE SOLVED: To provide a modified polyaluminosiloxane good in not only heat resistance, but also transparency, adhesive properties and sheet formability, an optical semiconductor element encapsulating material containing the polyaluminosiloxane, and an optical semiconductor device obtained...

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Bibliographische Detailangaben
Hauptverfasser:	AKAZAWA MITSUHARU, KATAYAMA HIROYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a modified polyaluminosiloxane good in not only heat resistance, but also transparency, adhesive properties and sheet formability, an optical semiconductor element encapsulating material containing the polyaluminosiloxane, and an optical semiconductor device obtained by encapsulating an optical semiconductor element using the encapsulating material. SOLUTION: The modified polyaluminosiloxane is obtained by reacting a polyaluminosiloxane with a silane coupling agent represented by the formula (I) wherein each of R1, R2and R3is independently an alkyl group or an alkoxy group, and X is a methacryloxy group, a glycidoxy group, an amino group, a vinyl group or a mercapto group, provided that at least two of R1, R2and R3are alkoxy groups. COPYRIGHT: (C)2010,JPO&INPIT