SEMICONDUCTOR CHIP ASSEMBLY EQUIPMENT

PROBLEM TO BE SOLVED: To provide a semiconductor chip assembly equipment which can effectively prevent a semiconductor chip from breakage, when pressing the tops of bumps to obtain the same height. SOLUTION: A leveling means 10, which makes tops 21a of a plurality of bumps 21 formed on a chip surface of a semiconductor chip 20 at the same height, has a support member 11 and pressing member 12, and the support member 11 supports the semiconductor chip 20 facing a surface against the pressing surface 12a which bumps 21 are formed, to the pressing member. The pressing member 12 has a pressing surface 12a, which faces a part of the chip surface including a portion, contacting with at least tops 21a of a plurality of bumps 21 and a recess portion 12b, whose portion facing to the chip surface except the pressing surface 12a backs to the inside of the pressing member 12, either at least the support member 11 or the pressing member 12 can travel and return, in a direction of mutual approach, and the pressing surface 12a of the pressing member 12 contacts with the tops 21a of the bumps 21, in a parallel state with the chip surface. COPYRIGHT: (C)2010,JPO&INPIT