SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a semiconductor device having a configuration in which a substrate for disposing a semiconductor chip and an external connection lead electrically connected to the semiconductor chip are formed by different members, wherein a molding resin for integrally fixing them is free from peeling of the external connection lead. SOLUTION: The semiconductor device 1 is provided in which an external connection lead 11 is formed of a plate material having conductivity, an embedded portion 115 embedded in a molding resin 9 and a protruding portion 114 protruding on the outside of the molding resin 9 are provided, the embedded portion 115 consists of a disposed portion 110 disposed on a surface 5a of the substrate 5 and a discrete portion spaced from the surface 5a of the substrate 5, a plurality of through-holes 116 penetrating in the thickness direction of the discrete portion are formed on the discrete portion, and at least the penetrating directions of the two through-holes 116 are inclined relatively. COPYRIGHT: (C)2010,JPO&INPIT