WIRING BOARD WITH BUILT-IN COMPONENT AND METHOD OF MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a method for manufacturing a wiring board with built-in component for easily and inexpensively manufacturing a wiring board with built-in component by reducing man-hours necessary for manufacturing the wiring board with built-in component. SOLUTION: A wiring board is manufactured via an arrangement process or a fixed process or the like. In the arrangement process, prepregs 71 to 74 are arranged so as to be overlapped, and an IC chip 21 is arranged in a through-hole 77, and metallic foils 151 and 152 are arranged on the surface of the prepregs 71 to 74. In a fixing process, a pressure is applied to the laminating direction of the prepregs 71 to 74 so that it is possible to integrate the prepregs 71 to 74 with metallic foils 151 and 152, and a gap between the IC chip 21 and the internal wall surface of the through-hole 77 is filled with resin 63 flowing out of the prepregs 71 to 74 when a pressure is applied so that the IC chip 21 can be fixed. COPYRIGHT: (C)2010,JPO&INPIT