DEVICE HAVING SEMICONDUCTOR CONSTITUENT AND METHOD FOR MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a semiconductor constituent improved in heat radiation performance which is achieved by coating its outer surface with a protective material, and also to provide a method for manufacturing a device having the semiconductor constituent. SOLUTION: In a device having at...

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Bibliographische Detailangaben
Hauptverfasser:	KONIG JENS, DONIS DIETER
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a semiconductor constituent improved in heat radiation performance which is achieved by coating its outer surface with a protective material, and also to provide a method for manufacturing a device having the semiconductor constituent. SOLUTION: In a device having at least one semiconductor constituent 4, the outer surface 6 of the semiconductor constituent 4 is coated with a protective material 5, and the outer surface 6 has a surface structure 9 thereon to increase a heat transfer surface area from the outer surface 6 to the protective material 5. Furthermore, a method of manufacturing a device having the semiconductor constituent 4 is provided. COPYRIGHT: (C)2010,JPO&INPIT