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PROBLEM TO BE SOLVED: To prevent a short circuit between scanning lines by conduction in an undercut portion arising from reciprocal diffusion of aluminum and silicon composing a bus wiring of the scanning line. SOLUTION: In the scanning line, a scanning signal line bus wiring 9 is composed of an in...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | PROBLEM TO BE SOLVED: To prevent a short circuit between scanning lines by conduction in an undercut portion arising from reciprocal diffusion of aluminum and silicon composing a bus wiring of the scanning line. SOLUTION: In the scanning line, a scanning signal line bus wiring 9 is composed of an intermediate layer 92 made of aluminum or aluminum alloy laminated with an extension portion of an upper electrode 26 as an upper layer and a lower layer made of a silicon system membrane 24 formed on an interlayer insulation film 14 which is arranged between a data line 8, and between the intermediate layer 92 and the lower layer 24, there is provided a silicon oxide film 95. COPYRIGHT: (C)2010,JPO&INPIT |
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