INFRARED IMAGING DEVICE AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a thermal infrared imaging device which is hardly generating anchoring phenomena, and reliable. SOLUTION: The thermal infrared imaging device is one, the detection part of which is supported separately from the semiconductor substrate. At the position opposite to the detector on the pixel region of the semiconductor substrate sidewalls oriented from deposition film are characteristically provided isolatedly. The width of the sidewalls are the thickness of the deposition layer, so they can be made thin to nano order. Therefore, the contact area of the sidewall and the semiconductor substrate can be made extremely small, so the probability to anchor is made very small. COPYRIGHT: (C)2010,JPO&INPIT