CHEMICAL MACHINERY POLISHING PAD
PROBLEM TO BE SOLVED: To provide a chemical machinery polishing pad which can reduce scratches made on a surface to be polished during a polishing work. SOLUTION: The chemical machinery polishing pad used in a chemical machinery polishing operation includes a polishing surface, a non-polishing surfa...
Gespeichert in:
| Hauptverfasser: | , , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | MOTONARI MASAYUKI UENO TOMIKAZU YAMAMOTO MASAHIRO TAI YUGO MIYAUCHI HIROYUKI |
| description | PROBLEM TO BE SOLVED: To provide a chemical machinery polishing pad which can reduce scratches made on a surface to be polished during a polishing work. SOLUTION: The chemical machinery polishing pad used in a chemical machinery polishing operation includes a polishing surface, a non-polishing surface opposite to the polishing surface, a side surface for connecting an outer edge of the polishing surface and an outer edge of the non-polishing surface and a plurality of grooves provided in the polishing surface side. The side surface includes an inclined surface connected to the polishing surface and the depth of the groove is not larger than the height of the inclined surface. COPYRIGHT: (C)2010,JPO&INPIT |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2009220265A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2009220265A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2009220265A3</originalsourceid><addsrcrecordid>eNrjZFBw9nD19XR29FHwdXT28PRzDYpUCPD38QwGst0VAhxdeBhY0xJzilN5oTQ3g5Kba4izh25qQX58anFBYnJqXmpJvFeAkYGBpZGRgZGZqaMxUYoAKCIiKw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>CHEMICAL MACHINERY POLISHING PAD</title><source>esp@cenet</source><creator>MOTONARI MASAYUKI ; UENO TOMIKAZU ; YAMAMOTO MASAHIRO ; TAI YUGO ; MIYAUCHI HIROYUKI</creator><creatorcontrib>MOTONARI MASAYUKI ; UENO TOMIKAZU ; YAMAMOTO MASAHIRO ; TAI YUGO ; MIYAUCHI HIROYUKI</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a chemical machinery polishing pad which can reduce scratches made on a surface to be polished during a polishing work. SOLUTION: The chemical machinery polishing pad used in a chemical machinery polishing operation includes a polishing surface, a non-polishing surface opposite to the polishing surface, a side surface for connecting an outer edge of the polishing surface and an outer edge of the non-polishing surface and a plurality of grooves provided in the polishing surface side. The side surface includes an inclined surface connected to the polishing surface and the depth of the groove is not larger than the height of the inclined surface. COPYRIGHT: (C)2010,JPO&INPIT</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; DRESSING OR CONDITIONING OF ABRADING SURFACES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; PERFORMING OPERATIONS ; POLISHING ; SEMICONDUCTOR DEVICES ; TRANSPORTING</subject><creationdate>2009</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20091001&DB=EPODOC&CC=JP&NR=2009220265A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76418</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20091001&DB=EPODOC&CC=JP&NR=2009220265A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MOTONARI MASAYUKI</creatorcontrib><creatorcontrib>UENO TOMIKAZU</creatorcontrib><creatorcontrib>YAMAMOTO MASAHIRO</creatorcontrib><creatorcontrib>TAI YUGO</creatorcontrib><creatorcontrib>MIYAUCHI HIROYUKI</creatorcontrib><title>CHEMICAL MACHINERY POLISHING PAD</title><description>PROBLEM TO BE SOLVED: To provide a chemical machinery polishing pad which can reduce scratches made on a surface to be polished during a polishing work. SOLUTION: The chemical machinery polishing pad used in a chemical machinery polishing operation includes a polishing surface, a non-polishing surface opposite to the polishing surface, a side surface for connecting an outer edge of the polishing surface and an outer edge of the non-polishing surface and a plurality of grooves provided in the polishing surface side. The side surface includes an inclined surface connected to the polishing surface and the depth of the groove is not larger than the height of the inclined surface. COPYRIGHT: (C)2010,JPO&INPIT</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2009</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFBw9nD19XR29FHwdXT28PRzDYpUCPD38QwGst0VAhxdeBhY0xJzilN5oTQ3g5Kba4izh25qQX58anFBYnJqXmpJvFeAkYGBpZGRgZGZqaMxUYoAKCIiKw</recordid><startdate>20091001</startdate><enddate>20091001</enddate><creator>MOTONARI MASAYUKI</creator><creator>UENO TOMIKAZU</creator><creator>YAMAMOTO MASAHIRO</creator><creator>TAI YUGO</creator><creator>MIYAUCHI HIROYUKI</creator><scope>EVB</scope></search><sort><creationdate>20091001</creationdate><title>CHEMICAL MACHINERY POLISHING PAD</title><author>MOTONARI MASAYUKI ; UENO TOMIKAZU ; YAMAMOTO MASAHIRO ; TAI YUGO ; MIYAUCHI HIROYUKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2009220265A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2009</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>MOTONARI MASAYUKI</creatorcontrib><creatorcontrib>UENO TOMIKAZU</creatorcontrib><creatorcontrib>YAMAMOTO MASAHIRO</creatorcontrib><creatorcontrib>TAI YUGO</creatorcontrib><creatorcontrib>MIYAUCHI HIROYUKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MOTONARI MASAYUKI</au><au>UENO TOMIKAZU</au><au>YAMAMOTO MASAHIRO</au><au>TAI YUGO</au><au>MIYAUCHI HIROYUKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>CHEMICAL MACHINERY POLISHING PAD</title><date>2009-10-01</date><risdate>2009</risdate><abstract>PROBLEM TO BE SOLVED: To provide a chemical machinery polishing pad which can reduce scratches made on a surface to be polished during a polishing work. SOLUTION: The chemical machinery polishing pad used in a chemical machinery polishing operation includes a polishing surface, a non-polishing surface opposite to the polishing surface, a side surface for connecting an outer edge of the polishing surface and an outer edge of the non-polishing surface and a plurality of grooves provided in the polishing surface side. The side surface includes an inclined surface connected to the polishing surface and the depth of the groove is not larger than the height of the inclined surface. COPYRIGHT: (C)2010,JPO&INPIT</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_JP2009220265A |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING |
| title | CHEMICAL MACHINERY POLISHING PAD |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-09T04%3A20%3A58IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=MOTONARI%20MASAYUKI&rft.date=2009-10-01&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2009220265A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |