CHEMICAL MACHINERY POLISHING PAD

PROBLEM TO BE SOLVED: To provide a chemical machinery polishing pad which can reduce scratches made on a surface to be polished during a polishing work. SOLUTION: The chemical machinery polishing pad used in a chemical machinery polishing operation includes a polishing surface, a non-polishing surfa...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	MOTONARI MASAYUKI, UENO TOMIKAZU, YAMAMOTO MASAHIRO, TAI YUGO, MIYAUCHI HIROYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a chemical machinery polishing pad which can reduce scratches made on a surface to be polished during a polishing work. SOLUTION: The chemical machinery polishing pad used in a chemical machinery polishing operation includes a polishing surface, a non-polishing surface opposite to the polishing surface, a side surface for connecting an outer edge of the polishing surface and an outer edge of the non-polishing surface and a plurality of grooves provided in the polishing surface side. The side surface includes an inclined surface connected to the polishing surface and the depth of the groove is not larger than the height of the inclined surface. COPYRIGHT: (C)2010,JPO&INPIT