MANUFACTURING METHOD OF ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To provide a manufacturing method of an electronic component capable of improving relative position accuracy between an electrode formed on one-side principal surface of the electronic component and an electrode formed on the other-side principal surface thereof. SOLUTION: This manufacturing method of the electronic component includes: a first patterning process of preparing an element matrix having first and second principal surfaces each having a conductive layer formed thereon, sticking the conductive layer of the second principal surface to a flat support body through an adhesive layer, and forming an electrode by carrying out patterning processing to the conductive layer of the first principal surface; and a second patterning process of sticking the electrode on the first principal surface to a flat and transparent support body through an adhesive layer, positioning the second principal surface by optically observing the first principal surface through the transparent support body, and forming an electrode by carrying out patterning processing to the conductive layer of the second principal surface. COPYRIGHT: (C)2009,JPO&INPIT