METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a semiconductor device which has a fast signal processing speed and has high reliability of a wiring film. SOLUTION: The method of manufacturing the semiconductor device including a recess forming step of forming a recess 3 in a film 2 includes an electromagnetic wav...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	ANDO YASUTO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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