METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
PROBLEM TO BE SOLVED: To provide a semiconductor device which has a fast signal processing speed and has high reliability of a wiring film. SOLUTION: The method of manufacturing the semiconductor device including a recess forming step of forming a recess 3 in a film 2 includes an electromagnetic wav...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a semiconductor device which has a fast signal processing speed and has high reliability of a wiring film. SOLUTION: The method of manufacturing the semiconductor device including a recess forming step of forming a recess 3 in a film 2 includes an electromagnetic wave setting chemical providing step of providing an electromagnetic wave setting chemical on an inner surface side of the recess after the recess forming step, and a curing step of curing the electromagnetic wave setting chemical by irradiation with an electromagnetic wave after the electromagnetic wave setting chemical providing step. COPYRIGHT: (C)2009,JPO&INPIT |
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