ELECTRONIC COMPONENT MOUNTER

PROBLEM TO BE SOLVED: To provide an electronic component mounter having two mounting heads, capable of preventing suction nozzle drive mechanisms in the mounting heads or a substrate recognition camera from being damaged when the two mounting heads collide with each other. SOLUTION: The mounting hea...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	URATA NAOKI, KASHIWATANI NAOKATSU, KANO YOSHINORI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an electronic component mounter having two mounting heads, capable of preventing suction nozzle drive mechanisms in the mounting heads or a substrate recognition camera from being damaged when the two mounting heads collide with each other. SOLUTION: The mounting heads 6 set in the electronic component mounter each cause a nozzle 5 to suck an electronic component from a component feeding apparatus and mount the electronic component on a printed board. In order to speed up the mounting of the electronic component, the two mounting heads 6 suck components and mount them on the printed board. A bumper 11 is attached around each of the mounting heads 6 to prevent a nozzle drive mechanism in each of the mounting heads 6 and the substrate recognition camera 8 from being damaged when the two mounting heads 6 collide with each other. COPYRIGHT: (C)2009,JPO&INPIT