METHOD FOR FABRICATING INTEGRATED CIRCUIT DEVICE

PROBLEM TO BE SOLVED: To provide a method for fabricating an integrated circuit device. SOLUTION: The integrated circuit has a plurality of TFTs and an electrical interconnect structure. In the process, at least some constituents of the TFTs are formed on a first substrate 10. At least the interconn...

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Hauptverfasser:	DODABALAPUR ANANTH, RAJU VENKATARAM REDDY, CHANDROSS EDWIN A, KATZ HOWARD EDAN
Format:	Patent
Sprache:	eng
Schlagworte:	ADVERTISING BASIC ELECTRIC ELEMENTS CRYPTOGRAPHY DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING DISPLAY DISPLAYING EDUCATION ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FREQUENCY-CHANGING LABELS OR NAME-PLATES NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PHYSICS SEALS SEMICONDUCTOR DEVICES SIGNS TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method for fabricating an integrated circuit device. SOLUTION: The integrated circuit has a plurality of TFTs and an electrical interconnect structure. In the process, at least some constituents of the TFTs are formed on a first substrate 10. At least the interconnect structure is formed on a second substrate 40. The two substrates 10 and 40 are laminated together to form the integrated circuit device having fully formed TFTs. COPYRIGHT: (C)2009,JPO&INPIT