WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF

PROBLEM TO BE SOLVED: To provide an improved wiring substrate, and its manufacturing method, wherein the occurrence of stress between an electronic component and a substrate is suppressed while connection reliability is maintained. SOLUTION: In the wiring substrate 1 comprising at least one insulati...

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Bibliographische Detailangaben
Hauptverfasser:	MIKAMI KENSUKE, FUJII KENICHIRO, KOKATSU TOSHINOBU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an improved wiring substrate, and its manufacturing method, wherein the occurrence of stress between an electronic component and a substrate is suppressed while connection reliability is maintained. SOLUTION: In the wiring substrate 1 comprising at least one insulating layer, at least one insulating layer of the wiring substrate has a stiffness distribution in the same plane, and the stiffness is set relatively high in the region comprising an electrode part where at least an electronic component 2 is mounted. COPYRIGHT: (C)2009,JPO&INPIT