TRANSFER FILM AND PATTERN FORMING METHOD

PROBLEM TO BE SOLVED: To provide a transfer film and a pattern forming method, capable of substantially improving workability, compared with a conventional manufacturing method, and manufacturing a pattern excellent in manufacturing efficiency even in thick film formation of a metallic film. SOLUTIO...

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Bibliographische Detailangaben
Hauptverfasser:	IWAMOTO SATOSHI, KAWAGISHI SEIJI, KUWATA HIROAKI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CINEMATOGRAPHY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a transfer film and a pattern forming method, capable of substantially improving workability, compared with a conventional manufacturing method, and manufacturing a pattern excellent in manufacturing efficiency even in thick film formation of a metallic film. SOLUTION: The pattern forming transfer film comprises (A) a resist layer, (B) a metallic layer and (C) an adhesive layer, which are successively laminated on a support film. COPYRIGHT: (C)2009,JPO&INPIT