SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing method and semiconductor manufacturing apparatus which achieve high throughput and improve yield and reliability of the semiconductor device by detecting and removing residue in an opening. SOLUTION: The semiconductor manufacturing apparatus includes: a chamber 11 in which a wafer w with a plurality of openings formed is carried in, inspected, and treated; mechanisms 15 and 16 which irradiate a predetermined position of the wafer w with an electron beam 14; a mechanism 17 which detects the opening with the residue from the plurality of openings by the irradiation of the electron beam 14; a gas supply mechanism 18 which supplies a process gas, which can remove the residue in the chamber 11 through activation; and a gas exhaust mechanism 19 which controls and exhausts the pressure in the chamber 11. COPYRIGHT: (C)2009,JPO&INPIT