ONE-SIDE RESIN-SEALED SEMICONDUCTOR APPARATUS

PROBLEM TO BE SOLVED: To provide a one-side resin-sealed semiconductor apparatus which is in an extremely stable state with little curvature in the whole process from a room temperature to a solder reflow time and has excellent mountability and reliability after mounting. SOLUTION: In a semiconducto...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SADO SATOSHI, SENOO SATOKO, UCHIDA TAKESHI, SUDO NOBUHIRO
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a one-side resin-sealed semiconductor apparatus which is in an extremely stable state with little curvature in the whole process from a room temperature to a solder reflow time and has excellent mountability and reliability after mounting. SOLUTION: In a semiconductor apparatus, a semiconductor device 3 is mounted on one side of a substrate 5, and only one side on a substrate surface side with the semiconductor device 3 mounted thereon is sealed by a resin composition. In the semiconductor apparatus, the resin composition satisfies a relationship represented by a formula (1):-3×t+4,800