METHOD OF MANUFACTURING CERAMIC SUBSTRATE

PROBLEM TO BE SOLVED: To provide a method of manufacturing a ceramic substrate for enabling an increase in the thickness of an internal conductive layer which hardly causes the generation of a delamination problem even in this case. SOLUTION: The method of manufacturing a ceramic substrate includes...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: FUJII SHUNICHI
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a method of manufacturing a ceramic substrate for enabling an increase in the thickness of an internal conductive layer which hardly causes the generation of a delamination problem even in this case. SOLUTION: The method of manufacturing a ceramic substrate includes steps of forming a first conductor layer 2 on a supporting material 1, coating a ceramic slurry 3a covering the first conductor layer 2 on the supporting material 1, acquiring a ceramic green sheet 3 with a conductor by drying up the ceramic slurry 3a, peeling the supporting material 1 from a laminated material of the supporting material 1 and the ceramic green sheet 3 with the conductor, coating conductor paste 2a on the first conductor layer 2 of the ceramic green sheet 3 with the conductor, forming a second conductor layer 2 by drying up the conductor paste 2a, coating the ceramic slurry 3a covering the second conductor layer 2 on the ceramic green sheet 3 with the conductor, acquiring a doubled laminating material including the doubled ceramic green sheet 3 with the conductor by drying up the ceramic slurry 3a, and baking the doubled laminated layer. COPYRIGHT: (C)2009,JPO&INPIT