PLATING SOLUTION AND METHOD OF MANUFACTURING CUTTING BLADE USING THE SAME

PROBLEM TO BE SOLVED: To provide a nickel plating solution capable of forming a plated coating film having high hardness and mitigated coating film stress. SOLUTION: This invention relates to the nickel plating solution comprising a nickel sulfate aqueous solution, wherein in addition to nickel sulf...

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Bibliographische Detailangaben
Hauptverfasser:	KOMIYAMA TOYOHIRO, SATO NOBUTAKA, SATO YUICHI, KOJIMA MASATAKA
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES GRINDING METALLURGY PERFORMING OPERATIONS POLISHING PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a nickel plating solution capable of forming a plated coating film having high hardness and mitigated coating film stress. SOLUTION: This invention relates to the nickel plating solution comprising a nickel sulfate aqueous solution, wherein in addition to nickel sulfate, malic acid or its salt, saccharine or its salt and thiourea are contained. COPYRIGHT: (C)2009,JPO&INPIT