CONTACT TYPE IMAGE SENSOR DEVICE WITH BUILT-IN OPTICAL ELEMENT

PROBLEM TO BE SOLVED: To reduce a manufacturing cost of the entire contact type image sensor device, and to overcome the problems of the increase in the cubic volume or assembly errors resulting from using a conventional GRIN image formation optical element. SOLUTION: This device is provided with a circuit board module 1, a luminescence module 2a electrically connected to and installed on the circuit board module 1, and an image sensor module 3 which has a photosensitive element set 30 electrically connected to and installed on the side of the luminescence module 2a on the circuit board module 1 and electrically connected to and installed on the circuit board module 1, and a micro condensing element set 31 installed on the photosensitive element set 30, wherein a light beam which is emitted with the luminescence module 2a to a document makes scattered light generate and the photosensitive element set 30 of the image sensor module 3 receives the scattered light from the document, so that an image of the document is detected. COPYRIGHT: (C)2009,JPO&INPIT