METHOD OF MANUFACTURING LIGHT-EMITTING ELEMENT ARRAY CHIP, MICRO-LENS MOLDING DIE, LIGHT-EMITTING ELEMENT HEAD, AND IMAGE FORMING APPARATUS

PROBLEM TO BE SOLVED: To provide a method of manufacturing a light-emitting element array chip, and the like, in which high precision is achieved with respect to thickness, protrusion of a transparent resin is suppressed and a micro-lens including a suitable pattern can be formed in a light emitting...

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Bibliographische Detailangaben
1. Verfasser:	OTA YASUHISA
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS CORRECTION OF TYPOGRAPHICAL ERRORS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES LINING MACHINES OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PERFORMING OPERATIONS PHYSICS PRINTING SELECTIVE PRINTING MECHANISMS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS STAMPS TRANSPORTING TYPEWRITERS WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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