METHOD OF MANUFACTURING LIGHT-EMITTING ELEMENT ARRAY CHIP, MICRO-LENS MOLDING DIE, LIGHT-EMITTING ELEMENT HEAD, AND IMAGE FORMING APPARATUS

PROBLEM TO BE SOLVED: To provide a method of manufacturing a light-emitting element array chip, and the like, in which high precision is achieved with respect to thickness, protrusion of a transparent resin is suppressed and a micro-lens including a suitable pattern can be formed in a light emitting...

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Bibliographische Detailangaben
1. Verfasser:	OTA YASUHISA
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS CORRECTION OF TYPOGRAPHICAL ERRORS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES LINING MACHINES OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PERFORMING OPERATIONS PHYSICS PRINTING SELECTIVE PRINTING MECHANISMS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS STAMPS TRANSPORTING TYPEWRITERS WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method of manufacturing a light-emitting element array chip, and the like, in which high precision is achieved with respect to thickness, protrusion of a transparent resin is suppressed and a micro-lens including a suitable pattern can be formed in a light emitting element. SOLUTION: The method of manufacturing a light-emitting element array chip 100 is characterized in that a micro-lens 103 is formed in an LED 102 by pressing a micro-lens molding die 200 onto a light-curing resin 302, measuring thickness of the micro-lens 103 by means of a spacer 205a and curing a light-curing resin 302, the micro-lens molding die 200 including a substrate; a plurality of holes 204 formed on a surface of the substrate and having a transferred shape of the micro-lens 103; and the spacer 205a formed in an outer circumferential area of the holes 204 and constituted of a metal thin film. COPYRIGHT: (C)2009,JPO&INPIT