SEMICONDUCTOR INSPECTION DEVICE

PROBLEM TO BE SOLVED: To provide a semiconductor inspection device having a probe structure capable of increasing the number of pins and narrowing a pitch in the X-X direction and in the Y-Y direction. SOLUTION: This semiconductor inspection device having a contactor connected electrically to an ele...

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Hauptverfasser:	YAMAGISHI KATSUNORI, SHIRAISHI AKINORI, HIGASHI MITSUTOSHI, AIZAWA MITSUHIRO, MURAYAMA HIROSHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS SEMICONDUCTOR DEVICES TESTING
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creator	YAMAGISHI KATSUNORI SHIRAISHI AKINORI HIGASHI MITSUTOSHI AIZAWA MITSUHIRO MURAYAMA HIROSHI
description	PROBLEM TO BE SOLVED: To provide a semiconductor inspection device having a probe structure capable of increasing the number of pins and narrowing a pitch in the X-X direction and in the Y-Y direction. SOLUTION: This semiconductor inspection device having a contactor connected electrically to an electrode pad formed on a semiconductor device which is a measuring object, and a substrate provided with the contactor, has a characteristic wherein the contactor is provided obliquely with respect to the main surface of the substrate. COPYRIGHT: (C)2009,JPO&INPIT
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fullrecord	<record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2009192309A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2009192309A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2009192309A3</originalsourceid><addsrcrecordid>eNrjZJAPdvX1dPb3cwl1DvEPUvD0Cw5wdQ7x9PdTcHEN83R25WFgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8V4BRgYGloaWRsYGlo7GRCkCAC60Iks</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SEMICONDUCTOR INSPECTION DEVICE</title><source>esp@cenet</source><creator>YAMAGISHI KATSUNORI ; SHIRAISHI AKINORI ; HIGASHI MITSUTOSHI ; AIZAWA MITSUHIRO ; MURAYAMA HIROSHI</creator><creatorcontrib>YAMAGISHI KATSUNORI ; SHIRAISHI AKINORI ; HIGASHI MITSUTOSHI ; AIZAWA MITSUHIRO ; MURAYAMA HIROSHI</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a semiconductor inspection device having a probe structure capable of increasing the number of pins and narrowing a pitch in the X-X direction and in the Y-Y direction. SOLUTION: This semiconductor inspection device having a contactor connected electrically to an electrode pad formed on a semiconductor device which is a measuring object, and a substrate provided with the contactor, has a characteristic wherein the contactor is provided obliquely with respect to the main surface of the substrate. COPYRIGHT: (C)2009,JPO&INPIT</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MEASURING ; MEASURING ELECTRIC VARIABLES ; MEASURING MAGNETIC VARIABLES ; PHYSICS ; SEMICONDUCTOR DEVICES ; TESTING</subject><creationdate>2009</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20090827&DB=EPODOC&CC=JP&NR=2009192309A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20090827&DB=EPODOC&CC=JP&NR=2009192309A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YAMAGISHI KATSUNORI</creatorcontrib><creatorcontrib>SHIRAISHI AKINORI</creatorcontrib><creatorcontrib>HIGASHI MITSUTOSHI</creatorcontrib><creatorcontrib>AIZAWA MITSUHIRO</creatorcontrib><creatorcontrib>MURAYAMA HIROSHI</creatorcontrib><title>SEMICONDUCTOR INSPECTION DEVICE</title><description>PROBLEM TO BE SOLVED: To provide a semiconductor inspection device having a probe structure capable of increasing the number of pins and narrowing a pitch in the X-X direction and in the Y-Y direction. SOLUTION: This semiconductor inspection device having a contactor connected electrically to an electrode pad formed on a semiconductor device which is a measuring object, and a substrate provided with the contactor, has a characteristic wherein the contactor is provided obliquely with respect to the main surface of the substrate. COPYRIGHT: (C)2009,JPO&INPIT</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MEASURING</subject><subject>MEASURING ELECTRIC VARIABLES</subject><subject>MEASURING MAGNETIC VARIABLES</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2009</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJAPdvX1dPb3cwl1DvEPUvD0Cw5wdQ7x9PdTcHEN83R25WFgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8V4BRgYGloaWRsYGlo7GRCkCAC60Iks</recordid><startdate>20090827</startdate><enddate>20090827</enddate><creator>YAMAGISHI KATSUNORI</creator><creator>SHIRAISHI AKINORI</creator><creator>HIGASHI MITSUTOSHI</creator><creator>AIZAWA MITSUHIRO</creator><creator>MURAYAMA HIROSHI</creator><scope>EVB</scope></search><sort><creationdate>20090827</creationdate><title>SEMICONDUCTOR INSPECTION DEVICE</title><author>YAMAGISHI KATSUNORI ; SHIRAISHI AKINORI ; HIGASHI MITSUTOSHI ; AIZAWA MITSUHIRO ; MURAYAMA HIROSHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2009192309A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2009</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MEASURING</topic><topic>MEASURING ELECTRIC VARIABLES</topic><topic>MEASURING MAGNETIC VARIABLES</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>YAMAGISHI KATSUNORI</creatorcontrib><creatorcontrib>SHIRAISHI AKINORI</creatorcontrib><creatorcontrib>HIGASHI MITSUTOSHI</creatorcontrib><creatorcontrib>AIZAWA MITSUHIRO</creatorcontrib><creatorcontrib>MURAYAMA HIROSHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YAMAGISHI KATSUNORI</au><au>SHIRAISHI AKINORI</au><au>HIGASHI MITSUTOSHI</au><au>AIZAWA MITSUHIRO</au><au>MURAYAMA HIROSHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SEMICONDUCTOR INSPECTION DEVICE</title><date>2009-08-27</date><risdate>2009</risdate><abstract>PROBLEM TO BE SOLVED: To provide a semiconductor inspection device having a probe structure capable of increasing the number of pins and narrowing a pitch in the X-X direction and in the Y-Y direction. SOLUTION: This semiconductor inspection device having a contactor connected electrically to an electrode pad formed on a semiconductor device which is a measuring object, and a substrate provided with the contactor, has a characteristic wherein the contactor is provided obliquely with respect to the main surface of the substrate. COPYRIGHT: (C)2009,JPO&INPIT</abstract><oa>free_for_read</oa></addata></record>
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recordid	cdi_epo_espacenet_JP2009192309A
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subjects	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS SEMICONDUCTOR DEVICES TESTING
title	SEMICONDUCTOR INSPECTION DEVICE
url	https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-09T15%3A29%3A09IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=YAMAGISHI%20KATSUNORI&rft.date=2009-08-27&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2009192309A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true