CONNECTOR PACKAGING SUBSTRATE AND METHOD OF TESTING CONNECTOR PACKAGING SUBSTRATE

PROBLEM TO BE SOLVED: To provide a packaging substrate that can prevent the connection error occurring when external connector is connected to a connector disposed in a printed circuit board. SOLUTION: A connector packaging substrate includes: a printed circuit board 2; a connector 5 connected to wi...

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Bibliographische Detailangaben
Hauptverfasser: TONO YASUTAKA, MORITA KENTA, HIKIMA KATSUAKI, SATO AKIHIRO, NAKANO TAKESHI
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a packaging substrate that can prevent the connection error occurring when external connector is connected to a connector disposed in a printed circuit board. SOLUTION: A connector packaging substrate includes: a printed circuit board 2; a connector 5 connected to wiring the printed circuit board 2; and a plurality of substrate connector 3 formed on the surface 4a of the printed circuit board 2, each having a body 6 holding the terminal 5. The colors of the bodies 6 of the plurality of the substrate connector 3 are different each other. Respective bodies 6 are formed almost the same shape and size with insert hole 11 for inserting external connector. The inner circumference 16 of the body 6 facing to the insert hole 11 has a barrier 17 for preventing to move the external connector to be inserted to another body 6 for inserting direction. COPYRIGHT: (C)2009,JPO&INPIT