RESIN SHEET FOR SEALING OPTICAL SEMICONDUCTOR ELEMENT AND OPTICAL SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a resin sheet for sealing an optical semiconductor element which has both properties of an adhesive quality and a heat resistance, and seals efficiently, and an optical semiconductor device which seals the optical semiconductor element by use of the resin sheet. SOLU...

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Bibliographische Detailangaben
Hauptverfasser: AKAZAWA MITSUHARU, KIMURA RYUICHI
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a resin sheet for sealing an optical semiconductor element which has both properties of an adhesive quality and a heat resistance, and seals efficiently, and an optical semiconductor device which seals the optical semiconductor element by use of the resin sheet. SOLUTION: This resin sheet for sealing the optical semiconductor element is a resin sheet for sealing the optical semiconductor element 1 composed of at least a sealing resin layer 3, a bonding resin layer 4 and a protective resin layer 2, wherein the sealing resin layer is arranged adjacent to the bonding resin layer, and the protective resin layer is laminated so as to coat both the layers directly or indirectly on the sealing resin layer and the bonding resin layer. This optical semiconductor device seals an optical semiconductor element 5 by use of the resin sheet for sealing the optical semiconductor element. COPYRIGHT: (C)2009,JPO&INPIT