EPOXY RESIN TABLET FOR SEMICONDUCTOR SEALING, AND MANUFACTURING METHOD THEREOF

PROBLEM TO BE SOLVED: To provide a manufacturing method in which epoxy resin tablets for semiconductor sealing which have superior flowability and moldability in sealing of a semiconductor element can be successively manufactured while cracking, chipping and scattering of powder of an epoxy resin co...

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Bibliographische Detailangaben
Hauptverfasser:	SADO SATOSHI, ANDO MOTOTAKE, UCHIDA TAKESHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MAKING GRANULES OR PREFORMS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PREPARATION OR PRETREATMENT OF THE MATERIAL TO BESHAPED RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIALCONTAINING PLASTICS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a manufacturing method in which epoxy resin tablets for semiconductor sealing which have superior flowability and moldability in sealing of a semiconductor element can be successively manufactured while cracking, chipping and scattering of powder of an epoxy resin composition during conveyance can be suppressed. SOLUTION: The manufacturing method of epoxy resin tablets for semiconductor sealing includes a process of obtaining a molding 2 by making a tablet of an epoxy resin composition for semiconductor sealing, and a process of forming a surface coating 3 of 5 to 50 μm in average thickness on a surface of the molding using polyethylene wax. COPYRIGHT: (C)2009,JPO&INPIT